JPH0536270Y2 - - Google Patents

Info

Publication number
JPH0536270Y2
JPH0536270Y2 JP1989008387U JP838789U JPH0536270Y2 JP H0536270 Y2 JPH0536270 Y2 JP H0536270Y2 JP 1989008387 U JP1989008387 U JP 1989008387U JP 838789 U JP838789 U JP 838789U JP H0536270 Y2 JPH0536270 Y2 JP H0536270Y2
Authority
JP
Japan
Prior art keywords
capillary
tip
transducer
square hole
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989008387U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02101540U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989008387U priority Critical patent/JPH0536270Y2/ja
Publication of JPH02101540U publication Critical patent/JPH02101540U/ja
Application granted granted Critical
Publication of JPH0536270Y2 publication Critical patent/JPH0536270Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78308—Removable capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1989008387U 1989-01-30 1989-01-30 Expired - Lifetime JPH0536270Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989008387U JPH0536270Y2 (en]) 1989-01-30 1989-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989008387U JPH0536270Y2 (en]) 1989-01-30 1989-01-30

Publications (2)

Publication Number Publication Date
JPH02101540U JPH02101540U (en]) 1990-08-13
JPH0536270Y2 true JPH0536270Y2 (en]) 1993-09-14

Family

ID=31214221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989008387U Expired - Lifetime JPH0536270Y2 (en]) 1989-01-30 1989-01-30

Country Status (1)

Country Link
JP (1) JPH0536270Y2 (en])

Also Published As

Publication number Publication date
JPH02101540U (en]) 1990-08-13

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